Their extruded aluminum heat sink profiles are designed to efficiently dissipate heat from electronic components, such as microprocessors, power transistors, and LED lig
Additional Information: Item Code: SLM49A Production Capacity: 30000
Section | : | INDUSTRIAL | |||||||||||
Commodity | : | HEAT SINKS | |||||||||||
Technique | : | Extrusion | |||||||||||
GRADE SERIES/ TEMPER | : |
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Size | : |
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Length | : | 1000 to 3650mm | |||||||||||
FINISH | : | Mill Finish | |||||||||||
PACKAGE | : | HDPE – SEA WORTHY PACKING | |||||||||||
APPLICATION | : | Its ability to move heat, thermal conductivity, is about half of copper. This limits the distance heat can be moved, conducted, away from the heat source in the base of a heat sink. |